Technology Roadmap

Rigid Flex Technology Roadmap

Time Frame /
Tech Segment
2020 2021 2022
Process Capability Ball Pitch 350 300 <300
min. Line / space 35 / 35 Subtractive 30 / 30 (button plating + subtractive)
Via Size / Pad Size : PTH 150 / 300 100 / 250
Via Size / Pad Size : Microvia 70 / 170 60 / 150 50 / 125
Solder Resist Alignment ±25 ±20 ±15
Dielectric / PI (FCCL) 12 (ED/RA Cu / RtR) 10(ED / RA Cu / RtR)
Dielectric / Prepreg / Film -25(1027 / film) <25 (1017 / film)
Rigid-flex Stake-up 9L~12L ELIC w / Heat-sink Structure
Materials Thermal / Dimensional
Stability / Hi Frequency
BT / BT-like
Dry film SR
Thermo-conductive
E / E Performance
Thermo-conductive
E / E Performance
Low DF PI / Coverlay / Film LCP / equivalent LCP / equivalent
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